The global power module packaging market size was USD 1.68 Billion in 2022 and is expected to register a rapid revenue CAGR of 9.7% during the forecast period. Rising demand for power module packaging technology in autonomous vehicle and Electric Vehicles (EV) is a major factor driving market revenue growth. Globally, EV Original Equipment Manufacturers (OEMs) are embracing Silicon Carbide (SiC) and Gallium Nitride (GaN) based power modules to elevate overall safety and performance standards of EV batteries. According to key findings of the International Energy Agency (IEA), EV sales exceeded 10 million in 2022. The share of EV in total sales tripled in last three years, from 4% in 2020 to 14% in 2022. Power module packaging is a crucial component for Hybrid-Electric Vehicles (HEV), Plug-In Hybrid-Electric Vehicles (PHEV), and Electric Vehicles (EV) traction inverters. This component is designed and engineered to perform critical task of transforming Direct Current (DC) electricity sourced from an EVs battery into Alternating Current (AC). In addition, power module packaging ensures highest electrical efficiency of EV’s by improving energy conversion, minimizing heat generation, and increasing driving range of EVs. The power module packaging technology is significantly incorporating to enhance Vehicle-to-Everything (V2X) communication capabilities across all levels (L1, L2, L3, L4, and L5) of Advanced Driver-Assistance System (ADAS). Power module packaging in ADAS automates various driving processes, including assisting in parking, maintaining lane position, and preventing collisions.
The latest market intelligence report underscores the impact of the COVID-19 pandemic on the global Power Module Packaging market, offering deep insights into the pandemic’s adverse effects on the global economy and, consequently, this particular business sector. The report carefully gauges the key market-influencing factors and considers the COVID-19 pandemic as one of the contributing elements for this industry’s potential downturn. Following the pandemic, drastic changes have been observed in the market dynamics and demand trends, which have caused financial difficulties for the businesses operating in this sector.
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Competitive Terrain:
The global Power Module Packaging industry is highly consolidated owing to the presence of renowned companies operating across several international and local segments of the market. These players dominate the industry in terms of their strong geographical reach and a large number of production facilities. The companies are intensely competitive against one another and excel in their individual technological capabilities, as well as product development, innovation, and product pricing strategies.
The leading market contenders listed in the report are:
SEMIKRON Elektronik GmbH Co. KG, Mitsubishi Electric Corporation, Infineon Technologies AG, Sanken Electric Co., Ltd, Vincotech GmbH, SCHOTT AG, NXP Semiconductors N.V., Dynex Semiconductor Ltd, Vicor Corporation, KYOCERA AVX Components (Salzburg) GmbH, Onsemi, STMicroelectronics N.V., ASE Technology Holding Co, Ltd., and Amkor Technology, Inc
Key market aspects studied in the report:
Market Scope: The report explains the scope of various commercial possibilities in the global Power Module Packaging market over the upcoming years. The estimated revenue build-up over the forecast years has been included in the report. The report analyzes the key market segments and sub-segments and provides deep insights into the market to assist readers with the formulation of lucrative strategies for business expansion.
Competitive Outlook: The leading companies operating in the Power Module Packaging market have been enumerated in this report. This section of the report lays emphasis on the geographical reach and production facilities of these companies. To get ahead of their rivals, the leading players are focusing more on offering products at competitive prices, according to our analysts.
Report Objective: The primary objective of this report is to provide the manufacturers, distributors, suppliers, and buyers engaged in this sector with access to a deeper and improved understanding of the global Power Module Packaging market.
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Market Segmentations of the Power Module Packaging Market
This market is segmented based on Types, Applications, and Regions. The growth of each segment provides accurate forecasts related to production and sales by Types and Applications, in terms of volume and value for the period between 2022 and 2030. This analysis can help readers looking to expand their business by targeting emerging and niche markets. Market share data is given on both global and regional levels. Regions covered in the report are North America, Europe, Asia Pacific, Latin America, and Middle East Africa. Research analysts assess the market positions of the leading competitors and provide competitive analysis for each company. For this study, this report segments the global Power Module Packaging market on the basis of product, application, and region:
Segments Covered in this report are:
Power Module Type Outlook (Revenue, USD Billion; 2019-2032)
- Silicon Carbide (SiC) Module
- Gallium Nitride (GaN) Module
- Insulated-Gate Bipolar Transistor (IGBT) Module
- Field-Effect Transistor (FET) Module
- Metal-Oxide-Semiconductor Field-Effect Transistor (MOSFET) Module
- Others
Technology Outlook (Revenue, USD Billion; 2019-2032)
- Standard Packaging
- Advanced Packaging
- Pressure-Contact Modules
- Others
Thermal type Outlook (Revenue, USD Billion; 2019-2032)
- Liquid-Cooled
- Air-Cooled
- Hybrid
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Major Geographies Analyzed in the Report:
- North America (U.S., Canada)
- Europe (U.K., Italy, Germany, France, Rest of EU)
- Asia Pacific (India, Japan, China, South Korea, Australia, Rest of APAC)
- Latin America (Chile, Brazil, Argentina, Rest of Latin America)
- Middle East Africa (Saudi Arabia, U.A.E., South Africa, Rest of MEA)
ToC of the report:
Chapter 1: Market overview and scope
Chapter 2: Market outlook
Chapter 3: Impact analysis of COVID-19 pandemic
Chapter 4: Competitive Landscape
Chapter 5: Drivers, Constraints, Opportunities, Limitations
Chapter 6: Key manufacturers of the industry
Chapter 7: Regional analysis
Chapter 8: Market segmentation based on type applications
Chapter 9: Current and Future Trends
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